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①The double-layer double-sided structure makes the copper foil cladding resistance lower and the electrical properties better.Application Areas
Electronic cables, communication equipment cables, data transmission cables, signal cables, car charging cables, robot cables, medical equipment cables.Product parameters of multilayer bimetallic tinsel wire:
| norm | Finished OD（mm） | Copper Cladding Direction | resistive（Ω/m）（20℃） | tensile strength（kgf） |
| 2*4（0.02） | 0.06～0.14 | Z+S/S+Z | 6.0～25.0 | ≥0.30 |
| 2*4（0.03） | 0.07～0.16 | Z+S/S+Z | 5.0～24.0 | ≥0.30 |
| 2*4（0.04） | 0.09～0.20 | Z+S/S+Z | 4.0～20.0 | ≥0.35 |
| 2*4（0.05） | 0.10～0.25 | Z+S/S+Z | 2.8～15.0 | ≥0.40 |
| 2*4（0.06） | 0.12～0.30 | Z+S/S+Z | 2.2～8.5 | ≥0.60 |
| 2*4（0.07） | 0.14～0.35 | Z+S/S+Z | 1.8～5.3 | ≥1.00 |
| 2*4（0.08） | 0.15～0.40 | Z+S/S+Z | 1.4～3.5 | ≥2.00 |
| 2*4（0.09） | 0.20～0.50 | Z+S/S+Z | 1.0～3.0 | ≥4.00 |
| 2*4（0.10） | 0.25～0.60 | Z+S/S+Z | 0.6～2.5 | ≥6.00 |
Description: ①Metal material selection: oxygen-free copper OFC; tinned copper; silver-plated copper; single-crystal copper OCC; copper alloys (copper-tin alloy CUSN; copper-iron alloy CUFEP; copper-silver alloy CUAG; copper-magnesium alloy CUMG; nickel-copper alloy (ConocoPower); Monel alloy).② Center filament selection: para-aramid (KEVLAR); heterocyclic aramid (TECHNORA); meso-aramid (NOMEX); aromatic polyester fiber (VECTRA); carbon fiber (PAN-BASED); glass fiber (GLASSFIBER); polyester (PET); nylon 66 (NYLON).
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